This thermal compound uses a premium copper micro powder for the best thermal conductivity. The unique compound's copper base makes it a good performer and gives it a distinct gold coloring. Your heatsink is made of copper, your thermal compound should be too.

Features:Copper micro powder for best thermal conductivityDesigned for overclocking of processorLow bleed performanceExcellent thermal resistance and high thermal conductivityEfficient thermal couplerEffective and positive heat sink sealer and heat transfer agent

Specifications:Color:GoldThermal Conductivity: > 4.5 W/m°CThermal Resistance: Specific Gravity: > 1.3@25°CNet Weight:2g

Application:

Apply a small amount of the compound and spread it until a thin layer covers the entire top of the CPU Die, GPU or Chipset to fill up the interface space between the chip and the heatsink surface. Installing the heatsink should flatten the thermal compound more.

Caution:Avoid contact with eyesWash hands after useUse only at room temperatureDo not ingestKeep out of reach of childrenhttp://www.frozencpu.com/thr-23.html?id=8YP3ZZJA