The MCW50-T™ is a fully assembled liquid-cooled thermoelectric (Peltier) solution, specifically designed for high-end graphics processor. Operating temperature ranges from ambient to freezing levels, depending on the thermal load.

This unit is intended for advanced users and requires appropriate insulation to prevent the formation of condensation in sensitive areas of the graphics card. Whereas Swiftech provides gaskets, and specific installation instructions for such assembly, utilization of this device is at the sole risk of the user.

Features:Extreme performance:1/2" OD tubing for optimal flow rate80 Watts built-in thermoelectric moduleOptimal cooling capacity: will dissipate 53 Watts continuous thermal load to ambient temperature.Versatility:The dual retention mechanism provides "out-of-the-box" compatibility with a wide range of graphics processors such as ATI® Radeon™ 9000 and up*, and nVidia® GForce™ and GForce entry level FX families of productsA special adapter bracket is also available for high-end "FX" (5800 and up) families of nVidia® products.

* not compatible with VGA adapters featuring TV Tuners.


Graphics card compatibility:

The standard MCW50-T™ ships with a dual retention mechanism composed of spring loaded screws providing compatibility with ATI® Radeon™ 9000 & up, and NVidia® GForce™ families of products. Swiftech guarantees compatibility with ATI and nVidia reference models only. ATI® All in Wonder series (with TV tuner) are known to be incompatible.

Thermolectrically cooled products cannot be installed with epoxy bonding agents, due to the fact that epoxies crystallize, and lose their bonding properties at freezing temperatures.

The MCW50-TFX™ is a special version specific to nVidia's high-end FX (5800 & up) families of products. Bench tests using an FX5900 Ultra showed an average 40°C drop in GPU operating temperature compared to stock cooling systems, which resulted in a 8% average increase in core overclockability (to 575Mhz) with this board and without voltage modifications.

Spring loaded assemblies feature compression limiters, to prevent over-tightening of the water-block to the graphics processor.

Due to the assembly high-profile, the MCW50-T™ occupies the 2 PCI slots located directly below the AGP slot.

System Integration:

Thermal load:

Whereas graphic card liquid coolers can be occasionally used with their own separate cooling circuit, most users will integrate the MCW50-T™ to the same circuit as the CPU. The following observations are relevant to the later case.

Careful consideration is necessary when adding a thermoelectric graphics processor cooler to the same circuit as a non thermoelectric-cooled CPU. The reason is simple: Peltier elements add their own internal thermal load (defined by Qmax) to the circuit, thus raising the temperature of the cooling fluid. The same observation is evidently true when adding this unit to an existing thermoelectrically cooled CPU. The additional thermal load requires more heat dissipation capacity from the heat exchanger.

The combined amount of heat (TEC + GPU) added to the circuit by the MCW50-T is approximately 115W (392BTU/hr). The resulting raise in temperature of the cooling fluid will essentially depend on the circuit's heat exchanger thermal characteristics. Users should check these characteristics with the vendor.

Depending on the system design goals (noise versus operating temperature), either a more powerful heat exchanger, or a more powerful fan may be required.

Power supply requirements:

The thermoeletric module pulls approximately 6A at 12 volts. When connecting the MCW50-T module to an existing power supply, users should verify their power supply current rating for the+12 volts line. The total amount of current required for system integration will depend on the number of devices already connected to the power supply. A 20A rating should amply suffice in most standard applications such as: single CPU, CDRrom (1 or 2), Floppy, hard drive (1 or 2) and PCI devices.

Specifications:Housing:CNC machined aluminum L2"xW2"xH1"Type II, class 2 blue anodized anticorrosion treatmentBuilt-in quick-connect fittings for 1/2" OD tubing (3/8" ID)Base plate:0.225" thick CNC machined copper base plateExceptional quality and attention to details: the copper base is lapped to 0.0003" (3/10 of 1/1000"), and polished to near-mirror finish to promote optimum thermal conductivity. Users are advised that while flatness is strictly respected for providing the most significant benefit to thermal interface, surface polish is a cosmetic component and may vary slightly from one heatsink to another. Re-lapping or polishing the copper base is never recommended. . Center section is raised to provide clearance for ATI® Radeon™ stabilizer frame assemblies.Heat dissipation capacity: Up to 53W continuous thermal load to ambient temperature.Thermoelectric module data, and requirements:Module hot side is directly submersed into the coolant for optimal heat dissipation.Power Supply Requirements: minimum 6A at 12 voltsSpecifications:L40xW40xH3.5mmQmax: 80.3 wImax: 8 ampsUmax: 15.2 vΔTmax: 65 °CImportant note: while users may replace the thermoelectric for different power modules, the MCW50-T™ can ONLY be used with 40x40mm physical size modules.
Assembly:Overall dimensions: L2.43" x W2.43" x H1.44" (L61.7 x W61.7 x H36.6 mm)Standard retention mechanism:nVidia: 4 spring loaded 2-56 S/S socket screws, providing ~20 lb. of pressure overall - pr5ovides compatibility with GForce families of products, including entry level "FX" models (up to 5600)ATI: 2 spring loaded 4-40 S/S philips screws, providing ~17 lb. of pressure overallOptional "FX" version:nVidia high-end FX series of cards (5800 and up) feature different hole spacing, and therefore require a different retention bracket.Tubing compatibility: 1/2" OD (3/8" ID), tube inserts included for use with soft vinyl tubing.

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