Foe has a new review up on an outstanding thermal transfer paste from Cooler Master named NanoFusion. This stuff managed to perform better than Arctic Silver.


Check it out here.

Any idea on how well it stacks against Artic Silver 5?

WOW - that's rather impressive!!!
I've just ordered a water loop about 5 minutes ago and haven't got any thermal paste yet - this is perfect timing!

One question, was the AS3 "set in" - I hear that it works better after it's had a chance to settle (never used it though)

You beat me to it MasterP . It seems to really make a few degrees of difference with Arctic Silver if you let it "burn in" for a while. I'd love to see the results of this if you set the machine to folding for a week in each setup, then ran the test. Still, the NanoFusion may have a burn in time too, depending on what it's made of...that would make it super impressive.

Grue

Since I received this back in November (I think), I have only used the Nanofusion. Not only on my test bench, but all my other PCs. It performs very well, and remains consistent.

I have not specifically tested it against AS5, but then I do not know of the differences between AS3 & AS5, but if you do then that would give you some idea.

Quote: Originally Posted by Foe Since I received this back in November (I think), I have only used the Nanofusion. Not only on my test bench, but all my other PCs. It performs very well, and remains consistent. I have not specifically tested it against AS5, but then I do not know of the differences between AS3 & AS5, but if you do then that would give you some idea.

Normally the difference between AS5 and AS3. AS5 is better by anywhere from 1 - 5C.

AS5 Specs:
Thermal Conductance: >350,000W/m2 °C (0.001 inch layer)
Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size: <0.49 microns <0.000020 inch

AS3 Specs:
Thermal conductivity: >9.0 W/mK (Hot Wire Method Per MIL-C-47113)
Thermal Resistance: <0.005°C-in²/Watt (0.001 inch layer)

I personally like Artic Silver Ceramique. I have found that it gives me better temps, it holds up even when I put my dry ice container on, and the particles are smaller than AS5 which allows it to fill in even more of the micro gaps on the cpu and hsf.

I think Apex should do a Thermal compound shoot out. Test each for say 5 days to give proper cure time to each compound. AS3, AS5, AS:C, Shin Etsu X23-7783D, FrozenCPU's new Copper Compund and whatever other compounds you would like.

I agree...let's see how they do after some cure time.

I like the AS Ceramique myself for the same reasons that Cpt stated.

The cure time that I tested each at was approximately 24 hours. In another review that I saw on the Nanofusion, it beat out AS5 as well. OCO - Nano Review

Quote: Originally Posted by Foe The cure time that I tested each at was approximately 24 hours. In another review that I saw on the Nanofusion, it beat out AS5 as well. OCO - Nano Review

that's really promising - thanks Foe!

Another great review Foe, great analysis and write up.

I also would like to suggest a general thermal compound shoot out. I have yet to see a review that takes into consideration full break in times, simply due to time constraints. Let's have NanoFusion, AS Ceramique, AS3, AS5, Geil copper, Shin Etsu, and a few others in a long term study.

Could you compare it to the phase change thermal compound? ItÂ’s worked quite well for me, and in most reviews it tops the low temp chart for non water-cooled systems. Plus its one of the easiest clean ups, and that is another factor in a thermal compound reviews. If you collected some different names and types for one big review that would be awesome.