Well I was asked to post these pics, and here they are....better late than never

This is the fastest way to void the warranty on a $400 chip

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Quote: Originally Posted by CPU Killer Well I was asked to post these pics, and here they are....better late than never This is the fastest way to void the warranty on a $400 chip

Got mine in front of me - waiting for mobo to make sure all is good first.

2 days and I'll be doin' the same

Lol so hueg.

(sp intentional)

seriously thats a big ass die.
so shiny..... if you focus hard enough you can see your soul in the reflection.

That is one beautiful chip...(after you take the cover off).

Quote: Originally Posted by CPU Killer Well I was asked to post these pics, and here they are....better late than never This is the fastest way to void the warranty on a $400 chip

"Wow!"

[thud]

"Ouch!"

(wishing that my jaw didn't hit a tile floor when I saw that photo.)

one question about this, doesnt the removal of the heatspreader make a gap inbetween the hsf and the cpu? or does the hs still have anough clamp to go all teh way down.

Well, I heard people how take their ISF off usually do it so they can do Direct Die Cooling.... but the heat sink should still touch the CPU.... cause there are still clamps that force it down onto the die....at least is should theoretically...

Still, that's a pretty big die...193mm^2 (squared) although the L2 Cache is probably taking up all that space...not the clock generator.......

I don't want to look into it but can anyone confirm that this uses the 0.13 micron process??

Yes, all modern AMD procs use .13 micron.

Yes, most of the space on the die is for the cache.

And yes, that is very very pretty

Quote: Originally Posted by Dimazz one question about this, doesnt the removal of the heatspreader make a gap inbetween the hsf and the cpu? or does the hs still have anough clamp to go all teh way down.

Some (not all) of the A64 mobos have a 4 hole pattern around the cpu socket. To get to it you have to remove the plastic/metal hold down unit that the mobo comes with. Then you can mount your waterblock using the 4 holes. But be warned!!! So far I know for a fact that the 4 holes pattern is in a differnt layout from the mobos for the XP to the A64. I had to have a custom top cut for my RBX to pick up the locations. That was on the ZNF3-150, As for the Abit mobo, I will find out the location of the holes soon and have another top cut to fit my S-RBX..... Hmm or maybe just have aonther S-RBX made so I can have 2 of em

Or you can use the plastic/metal hold down that comes on the A64 mobo to mount your waterblock/heatsink, but I don't like the ideal of only having 2 points of pressure. This would allow for "rocking" if your are not very careful. And the die on the A64 (assuming you removed the IHS) is very, very fragil. I have already heard of 2 ppl crushing/cracking the die of the A64 after they romoved the IHS. One guy was still trying to apply the 75 ft/lbs of force that AMD recommend (but that is with a IHS inplace) and it just crumbled it. Once you remove the IHS on the A64, I was mounting it with the same sprimg pressure that I would mount my barton 2800. This seemed to be a good solution, since I have already mounted this naked A64 over 10 differnt times now, and still no chip/cracks.

Any case, good luck to all that venture down this path of extream cooling!!! It is a hazardous journey, but can be very good for temps!!! Just removing the IHS dropped my temps by 12 deg C right away!! (excuse my spelling, I have a slight hangover from lastnight........ Oh and Happy New Year to all)

Is there an interface material between the ISF and the die?

Very pretty though, you definitely have bawls.

Quote: Originally Posted by neotheducky Is there an interface material between the ISF and the die? Very pretty though, you definitely have bawls.

Yes, it was a grey, chalky material that was very hard to clean off. If you look at the pics, you will see the "stains" it left behind. I tried to clean it all off, but after 15 min of scrubbing that is what was left.